Active Packaging

Active packaging technology (1994-96).

I proposed (US Pat. 5,496,743) a new device fabrication technology in which certain essential fabrication steps (lithography, etching, metallization, etc.) are performed after the partially processed device or circuit is packaged onto a host platform. The technique enables a new degree of freedom in manufacturing - lithography on opposite sides of a thin film - and permits the implementation of a variety of new devices and functions with ultra high performance. It also simplifies many schemes for integrating electronic and photonic devices into a single functional unit to be placed within the integrated circuitry on a silicon chip.

For more details, see [ Active Packaging ]

Key papers: 131, 144

Where the numbers refer to the attached list of Publications

[ # 144 abstract (html) ]

[ # 144 PostScript (170K download) ]

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